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SKIVED FIN HEATSINKS
MINIATURE COOLING AGGREGATES
HEATSINKS FOR BGA'S
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Fischer Elektronik
| Thermal conductive paste and thermal interface film
FSF 20 P FSF 30 PPhase Change thermal interface materialstrapless (free standing film) changing condition thermal conductive material as a foilmaterial with phase changing temperature at 48 °C or 52 °Cbest thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsinkthixotropic, therefore no migration of the material away from the moistened surfaceno influence on the thermal conductivity due to thermal cyclesonly low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devicesnot electrically conductive, but no insulatorself-adhesive properties, also suitable for large surfacesno toxic ingredientscustomised cuts upon requestwith double-sided protective film
FSF 15 P ...
Phase Change thermal interface material phase change material on a polyimide basisvery good thermal propertiesone-sided adhesive layer eases the mountingparticularly suitable for the application of spring clipscuts and contours upon customised drawing specifications
FSF 16 P ...
Phase Change thermal interface material phase change material on a polyimide basisvery good thermal propertiesone-sided adhesive layer eases the mountingparticularly suitable for the application of spring clipscuts and contours upon customised drawing specifications
WLP ...
silicon-containing thermally conductive paste
WLPF ...
Discontinued product - available on request only silicone-free thermal transfer compound
WLPF 07 ...
silicone-free thermal transfer compound
WLPK ...
Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity
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