Heatsinks for BGAs : ICK BGA 15 x 15 x 6
Features
way of fixation: | - therm. conductive foil
- therm. cond. adhesive
|
socket: | universal |
suitable for processor type: | universal |
width: | 15 mm |
height: | 6 mm |
plate thickness: | 1.8 mm |
length: | 15 mm |
thermal resistance: | 29.5 - 8 K/W |
dissipation loss: | 2 W |
surface: | black anodised |
Technical Drawing
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel