Thermally conductive adhesive : WLK DK 4

Features

thermal conductivity:
1 W/m·K
specific thermal resistance:
118°C cm/W
working life at room temperature:
approx. 30 min
hardening time:
60°C approx. 4 h/25°C approx. 16 h
volume resistance:
8·1011 Ω/cm
temperature range:
-50°C... +145°C
glue layer:
Epoxid
mixture proportion:
1:1
contents of delivery:
1x 4 ml syringe / 3x mixer WLK M4


For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks