Thermally conductive adhesive : WLK 30
Features
| thermal conductivity: | 0.836 W/m·K |
| specific thermal resistance: | 1.2 m·K/W |
| hardening time: | 20°C approx. 16-24h / 25°C approx. 8 h / 120°C approx. 20 min |
| volume resistance: | 1016 Ω/cm |
| temperature range: | -56°C... +149°C |
| glue layer: | Epoxid |
| mixture proportion: | 10:1 |
| composition: | 30 g resin/3 g hardener |
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel
