Attachable heatsink : FK 243 MI 247 O

Features

material:
copper (Cu)
for transistor:
  • TO 220
  • TO 248
  • SIP-Multiwatt
  • TO 247
  • TO 218
width:
20 mm
height:
13 mm
length:
27 mm
thermal resistance:
18.4 K/W
surface:
solderable surface
version:
without solder lug
material thickness:
0.6 mm

Technical Drawing



For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks