Pin heatsinks : ICK S 18 x 18 x 10

Features

design:
rectangle
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
18 mm
height:
10 mm
plate thickness:
2 mm
weight:
3.1 g
length:
18 mm
thermal resistance:
6.8 - 3 K/W
dissipation loss:
8 W
surface:
Al-natural

Technical Drawing



For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

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