Pin heatsinks : ICK S 17 x 17 x 20
Features
design: | rectangle |
way of fixation: | - therm. conductive foil
- therm. cond. adhesive
|
socket: | universal |
suitable for processor type: | universal |
width: | 17.3 mm |
height: | 20 mm |
plate thickness: | 3.5 mm |
weight: | 5.6 g |
length: | 17.3 mm |
thermal resistance: | 7.89 - 2.5 K/W |
dissipation loss: | 6.3 W |
surface: | Al-natural |
Technical Drawing
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel