Pin heatsinks : ICK S 10 x 10 x 6,5

Features

design:
rectangle
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
10 mm
height:
6.5 mm
plate thickness:
2 mm
weight:
1 g
length:
10 mm
thermal resistance:
25 - 18 K/W
dissipation loss:
2.5 W
surface:
Al-natural

Technical Drawing



For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

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