Heatsinks for BGAs : ICK BGA 40 x 40
Features
| way of fixation: | - therm. conductive foil
- therm. cond. adhesive
|
| socket: | universal |
| suitable for processor type: | universal |
| width: | 40 mm |
| height: | 6 mm |
| plate thickness: | 1.8 mm |
| length: | 40 mm |
| thermal resistance: | 14.6 - 5.8 K/W |
| dissipation loss: | 4.3 W |
| surface: | black anodised |
Technical Drawing
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel
