Heatsinks for BGAs : ICK BGA 12 x 12 x 18
Features
| way of fixation: | - therm. conductive foil
- therm. cond. adhesive
|
| socket: | universal |
| suitable for processor type: | universal |
| width: | 12 mm |
| height: | 18 mm |
| plate thickness: | 3.6 mm |
| length: | 12 mm |
| thermal resistance: | 24.5 - 5.1 K/W |
| dissipation loss: | 2.3 W |
| surface: | black anodised |
Technical Drawing
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel
