Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

Heatsinks for BGAs : ICK BGA 31 x 31

Add to request.

way of fixation

therm. conductive foil
therm. cond. adhesive

socket

universal

suitable for processor type

universal

width

31 mm

height

6 mm

plate thickness

1.8 mm

length

31 mm

thermal resistance R_th

18.6 - 5.5 K/W

dissipation loss P_v

3.4 W

surface

black anodised

DAU Telephone (+44) 01243 553031

For further information, technical & product support contact - Technical
For pricing, lead-times and sample requests contact - Sales

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

ICK BGA 31 x 31

SMD Heatsinks on Tape and Reel

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New Skived Fin Heatsinks

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