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Heatsinks for BGAs  : ICK BGA 19 x 19 x 14
Add to request.
way of fixation
  • therm. conductive foil
  • therm. cond. adhesive
socket
universal
suitable for processor type
universal
width
19 mm
height
14 mm
plate thickness
1.8 mm
length
19 mm
thermal resistance Rth
21 - 5 K/W
dissipation loss Pv
2.8 W
surface
black anodised
Technical Drawing Drawings & 3 Data Files Technical Information

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68 - 74 Barnham Road, Barnham
West Sussex, PO22 0ES, UK
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