Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

Heatsinks for PGA : ICK PGA 11 x 11

Add to request.

way of fixation

therm. conductive foil
therm. cond. adhesive

socket

universal

suitable for processor type

universal

width

27.95 mm

height

15.24 mm

plate thickness

3.5 mm

length

24.76 mm

thermal resistance R_th

10.9 - 2.6 K/W

dissipation loss P_v

4.5 W

surface

black anodised

DAU Telephone (+44) 01243 553031

For further information, technical & product support contact - Technical
For pricing, lead-times and sample requests contact - Sales

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

ICK PGA 11 x 11

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks

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