Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

Heatsinks for PGA : ICK PGA 9 x 9

Add to request.

way of fixation

therm. cond. adhesive
therm. conductive foil

socket

universal

suitable for processor type

universal

width

24.2 mm

height

12.3 mm

plate thickness

3.5 mm

length

24.2 mm

thermal resistance R_th

14 - 3.3 K/W

dissipation loss P_v

3 W

surface

black anodised

DAU Telephone (+44) 01243 553031

For further information, technical & product support contact - Technical
For pricing, lead-times and sample requests contact - Sales

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

ICK PGA 9 x 9

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks

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