Thermally conductive adhesive : WLK 10
Features
thermal conductivity: | 0.836 W/m·K |
specific thermal resistance: | 1.2 m·K/W |
hardening time: | 20°C approx. 16-24h / 25°C approx. 8 h / 120°C approx. 20 min |
volume resistance: | 1016 Ω/cm |
temperature range: | -56°C... +149°C |
glue layer: | Epoxid |
mixture proportion: | 10:1 |
composition: | 10 g resin/1 g hardener |
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel