Thermal conductive paste and thermal interface film : WLP 004
Features
material: | silicon thermal transfer compound |
composition: | silicone oil, inorganic filling material |
basin: | box |
specific electrical resistance: | >1012 Ω/cm |
flashpoint: | none (DIN 53213) |
drop point: | >260°C |
delivery quantity: | 4 g |
thermal resistance: | no bleeding at (4 h/200°C) |
acid number: | < 0.01 mg KOH/g |
consistance: | pastey |
colour: | white |
density: | 1.1 g/cm3 |
thermal conductivity: | 0.61 W/m·K |
temperature range: | -40°C ... +250°C |
solubility in water: | insoluble |
For further information, technical support, pricing and lead times please contact -
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