Heatsinks, Enclosures, Connectors, Fischer Elektronik, Dau Components

ICK BGA 10 x 1010 x 10 x 6 mm, for IC design BGA and others particularly suited for Ball Grid Arraysheatsink dimensions match the respective BGA-typecan be glued directly on the BGA componentdouble-sided adhesive thermal conductive foil WLF ...
surface: black anodised

ICK BGA 10 x 10 x 1010 x 10 x 10 mm, for IC design BGA and others

ICK BGA 11 x 11 x 611 x 11 x 6 mm, for IC design BGA and others

ICK BGA 11 x 11 x 1011 x 11 x 10 mm, for IC design BGA and others

ICK BGA 14 x 1414 x 14 x 6 mm, for IC design BGA and others

ICK BGA 14 x 14 x 1014 x 14 x 10 mm, for IC design BGA and others

ICK BGA 15 x 15 x 615 x 15 x 6 mm, for IC design BGA and others

ICK BGA 15 x 15 x 1015 x 15 x 10 mm, for IC design BGA and others

ICK BGA 15 x 15 x 1415 x 15 x 14 mm, for IC design BGA and others

ICK BGA 19 x 19 x 619 x 19 x 6 mm, for IC design BGA and others

ICK BGA 19 x 19 x 1019 x 19 x 10 mm, for IC design BGA and others

ICK BGA 19 x 19 x 1419 x 19 x 14 mm, for IC design BGA and others

For further information, technical support, pricing and lead times please contact - Sales

DAU Components Telephone (+44) 01243 553031

TOLA Case Series

New Skived Fin Heatsinks

New Range - AV Switches

Heatsinks f.cool Cases f.case Connectors f.con

OPEN AN ACCOUNT Request Cross Referencing – QUOTE, DATA & SAMPLES

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