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SKIVED FIN HEATSINKS
MINIATURE COOLING AGGREGATES
HEATSINKS FOR BGA'S
HEATSINKS MACHINED FROM SOLID ALUMINIUM - KGR
EXTRUDED HEATSINKS FOR PCB MOUNTING
SMALL HEATSINKS
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ICK BGA 10 x 1010 x 10 x 6 mm, for IC design BGA and others particularly suited for Ball Grid Arraysheatsink dimensions match the respective BGA-typecan be glued directly on the BGA componentdouble-sided adhesive thermal conductive foil WLF ...
surface: black anodised
ICK BGA 10 x 10 x 1010 x 10 x 10 mm, for IC design BGA and others
ICK BGA 11 x 11 x 611 x 11 x 6 mm, for IC design BGA and others
ICK BGA 11 x 11 x 1011 x 11 x 10 mm, for IC design BGA and others
ICK BGA 14 x 1414 x 14 x 6 mm, for IC design BGA and others
ICK BGA 14 x 14 x 1014 x 14 x 10 mm, for IC design BGA and others
ICK BGA 15 x 15 x 615 x 15 x 6 mm, for IC design BGA and others
ICK BGA 15 x 15 x 1015 x 15 x 10 mm, for IC design BGA and others
ICK BGA 15 x 15 x 1415 x 15 x 14 mm, for IC design BGA and others
ICK BGA 19 x 19 x 619 x 19 x 6 mm, for IC design BGA and others
ICK BGA 19 x 19 x 1019 x 19 x 10 mm, for IC design BGA and others
ICK BGA 19 x 19 x 1419 x 19 x 14 mm, for IC design BGA and others
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