Thermal conductive paste and thermal interface film : WLP 300 S

Features

material:
silicon thermal transfer compound
composition:
silicone oil, inorganic filling material
basin:
cartridge (310 ml)
specific electrical resistance:
>1012 Ω/cm
flashpoint:
none (DIN 53213)
drop point:
>260°C
delivery quantity:
300 g
thermal resistance:
no bleeding at (4 h/200°C)
acid number:
< 0.01 mg KOH/g
consistance:
pastey
colour:
white
density:
1.1 g/cm3
thermal conductivity:
0.61 W/m·K
temperature range:
-40°C ... +250°C
solubility in water:
insoluble


For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

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