Thermal conductive paste and thermal interface film : FSF 20 P
Features
| material thickness: | 0.2±0,025 mm |
| colour: | white |
| density: | 2.9 g/cm3 |
| phase change temperature: | 48 °C |
| thermal conductivity: | 2 W/m·K |
| thermal resistance (1 in2, TO 3) at contact pressure of: | 0.08 K/W
0.031 N/mm2 |
| temperature range: | ≤+150°C |
| adhesive holding force: | 0.6 N/mm2 |
| dielectric constant: | 4.8 [1 kHz] / 4.4 [1 MHz] |
| class of inflammability: | UL 94 V-0 |
| type of delivery: | - plates, usable area 400x300mm
- other dimensions upon request
|
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
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