Heatsinks for BGAs : ICK BGA 19 x 19 x 6

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
19 mm
height:
6 mm
plate thickness:
1.8 mm
length:
19 mm
thermal resistance:
27 - 11 K/W
dissipation loss:
2 W
surface:
black anodised

Technical Drawing



For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

SMD Heatsinks on Tape and Reel

TOLA Case Series

New Skived Fin Heatsinks