Heatsinks for BGAs : ICK BGA 19 x 19 x 14
Features
way of fixation: | - therm. conductive foil
- therm. cond. adhesive
|
socket: | universal |
suitable for processor type: | universal |
width: | 19 mm |
height: | 14 mm |
plate thickness: | 1.8 mm |
length: | 19 mm |
thermal resistance: | 21 - 5 K/W |
dissipation loss: | 2.8 W |
surface: | black anodised |
Technical Drawing
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel