Heatsinks for BGAs : ICK BGA 15 x 15 x 10
Features
way of fixation: | - therm. conductive foil
- therm. cond. adhesive
|
socket: | universal |
suitable for processor type: | universal |
width: | 15 mm |
height: | 10 mm |
plate thickness: | 1.8 mm |
length: | 15 mm |
thermal resistance: | 27 - 7.6 K/W |
dissipation loss: | 2.2 W |
surface: | black anodised |
Technical Drawing
For further information, technical support, pricing and lead times please contact -
Sales
DAU Components Telephone
(+44) 01243 553031
SMD Heatsinks on Tape and Reel