Heatsinks for BGAs : ICK BGA 14 x 14

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
14 mm
height:
6 mm
plate thickness:
1.8 mm
length:
14 mm
thermal resistance:
30 - 8.5 K/W
dissipation loss:
2.1 W
surface:
black anodised

Technical Drawing



For further information, technical support, pricing and lead times please contact -  Sales

DAU Components Telephone (+44) 01243 553031

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