Ideal for dissipating greater heat volumes in small spaces, these miniature cooling aggregates are highly efficient as more heat can be conducted away per unit of volume this way, than with natural convection, thanks to improved air flow. To meet the demand for small-volume cooling aggregates, Fischer Elektronik is expanding its existing product range in the LAM and LAM K ranges with the new LAM D design. The new aluminium profiles offer twice the component mounting area and are available with dimensions of (W x H) 60.5 x 30mm, 80.8 x 40mm and 100.5 x 50mm. The miniature cooling aggregates of the LAM D series are suitable for installation in a case or for mounting on a PCB, etc. Their compact design with interior cooling fins as a heat exchange structure enables homogenous heat dissipation. Powerful axial fans are available in 5, 12 and 24V DC versions and generate a very high air throughput with greater pressure, enabling even longer cooling lines to be bridged. Additional surface coatings and profile lengths or different fan types and voltages are also available, as well as holes or machining to customer drawings.
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DAU Components (+44) 01243 553031
Expanding our range of Thermal Interface Materials
New colour options for 'Design' cases and enclosures
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