Increasing miniaturisation in SMD electronic components has led to a need to cool devices at the board level. This has driven the design and manufacture of component level heat-sinks, designed for SMD devices. The new ICK SMD range from Fischer Elektronik is derived from the ICK range of extrusion profiles, and can be utilised for most SMD footprints. The fins can be aligned in any direction in order to channel heat away from the devices, with efficient and low-profile design making them as unobtrusive as possible.
Designed to fit a range of common SMD IC case designs, this ICK SMD range can also be designed to meet customer’s specification. The heatsinks can be attached to the IC case using either double sided thermally conductive adhesive tape or two-part conductive adhesive. In addition to the standard black anodised finish, the range is also available in a special solderable finish for soldering to copper surfaces.
Most of the designs are available in tape and reel for automatic processing.
The new ICK SMD range offers both space-saving and weight-saving and, above all, a simple solution to circuit-board level heat dissipation.
For more information and samples please contact us.
DAU Components Telephone. +44 (0) 1243 553031